Low melting point solder plating (melting point 60~110℃)
Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!
Low heat-resistant materials have issues of "distortion, misalignment, and reduced characteristics" due to the heat during implementation (reflow). With the newly developed low-melting-point solder plating, the melting point can be selected in the low temperature range of 60 to 110°C to match the heat resistance of the target materials. This allows for implementation without damage or alteration. <Examples of applications> - PZT (piezoelectric elements) - CdTe (cadmium telluride) - Resin materials (such as PET) - micro LED (LTPS) etc... for implementation solder.
- Company：新菱 電子加工品部
- Price：Other
